Product Description
Sputtering target is mainly used in electronics and information industry, such as integrated circuits, information storage, LIQUID crystal display, laser memory, electronic control devices, etc. Can also be used in glass coating field; It can also be used in wear-resistant materials, high temperature corrosion resistance, high-grade decorative products and other industries.
Grade |
N |
C |
H |
Fe |
O |
Residuals Elelement |
Max Total |
Gr1 | 0.03 | 0.08 | 0.015 | 0.2 | 0.18 | 0.1 | 0.4 |
Grade |
Tensile strength,Mpa (min) |
Yield strength,MPa (min) |
Elongation, % (min) |
Reduction of Area, % (min) |
|||
Gr1 | 240 | 138~20 | 24 | 30 |
Product Features
purity
Purity is one of the main performance index of target material,because the purity of target material had a great influence on the performance of the film.
In practice, however, also have different requirements for the purity of target material.
impurity content
Solid impurities in the target material and the porosity of oxygen and moisture are the main sources of deposition film.
Different USES of the target material have different requirements of different impurity content.
For example, semiconductor industrial pure aluminum and aluminum alloy material, the alkali metal content and radioactive element content have special requirements.