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Product Description

Sputtering target is mainly used in electronics and information industry, such as integrated circuits, information storage, LIQUID crystal display, laser memory, electronic control devices, etc.  Can also be used in glass coating field;  It can also be used in wear-resistant materials, high temperature corrosion resistance, high-grade decorative products and other industries.  

Chemical Component

Grade
C
H
Fe
O
Residuals
Elelement
Max
Total
Gr1 0.03 0.08 0.015 0.2 0.18 0.1 0.4

Physical Property

Grade Tensile   strength,Mpa
 (min)
Yield   strength,MPa
    (min)
Elongation,   % (min) Reduction of   Area, %
  (min)
Gr1 240 138~20 24 30

Product Features

purity

Purity is one of the main performance index of target material,because the purity of target material had a great influence on the performance of the film. 

In practice, however, also have different requirements for the purity of target material.

impurity content

Solid impurities in the target material and the porosity of oxygen and moisture are the main sources of deposition film.

 Different USES of the target material have different requirements of different impurity content.

 For example, semiconductor industrial pure aluminum and aluminum alloy material, the alkali metal content and radioactive element content have special requirements.

density

In order to reduce the porosity of solid target material, improve the performance of the sputtering film usually require target material with high density. The density of the target material not only affect the sputtering rate, but also affects the electrical and optical properties of film. The higher the density of target, the performance of the film, the better. 



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